2.5D/3D硅基光电子集成技术及应用

欧祥鹏; 杨在利; 唐波; 李志华; 罗军; 王文武; 杨妍

doi:10.13756/j.gtxyj.2023.01.001

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2.5D/3D硅基光电子集成技术及应用

特邀稿件 | 更新时间：2023-01-16

- 2.5D/3D硅基光电子集成技术及应用
- Silicon Photonic 2.5D/3D Integration Technology and Its Applications
- 光通信研究 2023年第1期页码：1-16
- 作者机构：
  
  中国科学院微电子研究所　集成电路先导工艺研发中心，北京　100029
- 作者简介：
  
  欧祥鹏（1996-），男，广西北海人。博士，主要研究方向为硅基光电子学。
  杨妍，研究员。E-mail：yyang10@ime.ac.cn
- 基金信息：
  
  国家自然科学基金青年资助项目(61904196);国家自然科学基金面上资助项目(62274179);国家重点研发计划资助项目(2022YFB2802400);国家自然科学基金重点资助项目(62235001)
- DOI：10.13756/j.gtxyj.2023.01.001
  中图分类号： TN256
- 纸质出版日期：2023-02-10，
  
  收稿日期：2022-10-21，
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欧祥鹏，杨在利，唐波，等. 2.5D/3D硅基光电子集成技术及应用[J].光通信研究，2023(1)：1-16

OU X P, YANG Z L, TANG B, et al. Silicon Photonic 2.5D/3D Integration Technology and Its Applications[J]. Study on Optical Communications, 2023(1):1-16
欧祥鹏，杨在利，唐波，等. 2.5D/3D硅基光电子集成技术及应用[J].光通信研究，2023(1)：1-16 DOI： 10.13756/j.gtxyj.2023.01.001.

OU X P, YANG Z L, TANG B, et al. Silicon Photonic 2.5D/3D Integration Technology and Its Applications[J]. Study on Optical Communications, 2023(1):1-16 DOI： 10.13756/j.gtxyj.2023.01.001.

摘要

全球网络流量急速增长，数据传输所需带宽和能源消耗也随之快速增加，传统电子信息互联架构已无法满足日益增长的带宽和节约能耗的需求。硅基光电子技术具有带宽高、能耗低并且可以利用成熟的互补金属氧化物半导体（CMOS）技术将光子集成电路和电子集成电路大规模集成在硅衬底上等优势，能满足下一代数据传输系统的迫切需求。2.5D/3D硅基光电子集成技术可以有效缩短光芯片和电芯片之间电学互连长度、减小芯片尺寸，从而减小寄生效应、提高集成密度和降低功耗。文章介绍了硅基光电子集成技术的不同方案和最新进展，并展望了硅基光电子芯片结合2.5D/3D集成技术在数据通信、激光雷达、生化传感以及光计算等领域的应用前景。

Abstract

With the explosive growth of global network traffic and the consequent increase in bandwidth and energy consumption required for data transmission

traditional electronic interconnection architectures are no longer able to meet the requirement of the growing bandwidth and energy conservation. Silicon-based photonics featured as high bandwidth

low energy consumption

and more importantly

compatibility with Complementary Metal-Oxide-Semiconductor (CMOS) technologies enables the large-scale Photonic Integrated Circuits (PIC) and Electronic Integrated Circuits (EIC) to be integrated in a single substrate

hence it is regarded as one of the most promising solutions to address these challenges. However

with the increasing frequency of signals and the increasing number of integrated photonics and electronic devices

parasitic effects are becoming more prominent

leading to a significant degradation in the integration density

bandwidth density

and energy efficiency of the chip. 2.5D/3D integration technologies can effectively reduce the electrical interconnect length and chip size

thus reducing parasitic effects and power consumption

as well as increasing integration density. This paper presents different schemes of silicon based optoelectronic integration and its recent advances

and looks forward to the application prospects of 2.5D/3D integration technologies in data communication

Light Detection and Ranging (LiDAR)

biochemical sensing

and optical computing

et al.

关键词

光通信硅光光电集成2.5D/3D集成硅通孔转接板

Keywords

optical communicationsilicon photonicselectronic-photonic integration2.5D/3D integrationthrough-silicon-viainterposer

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