Du Pujun etc. Metallized Package of Semiconductor Light Source Devices. [J]. (4):40-47(1990) DOI: 10.13756/j.gtxyj.1990.04.006.
Metallized Package of Semiconductor Light Source Devices
摘要
本文介绍长波长光源器件的金属化耦合封装工艺
并通过工艺试验和生产实践
对采用新工艺制作的产品进行了可靠性考核
其结果表明这种工艺是成功的。尤其是采用YAG激光焊接技术
较好的解决了光纤定位工艺。
Abstract
In this paper
the metallized package workmanship of long wavelength light source devices is described. The reliability of the novel products made with this process has passed the proof test and achieved successful result. In particular
YAG laser welding technique has satisfied the fiber positioning process.