Wang Suqin Li Mingjuan. Discussion on the Thermal Resistance of InGaAsP/InP LD in Soldering Process. [J]. (1):41-43(1996) DOI: 10.13756/j.gtxyj.1996.01.003.
Discussion on the Thermal Resistance of InGaAsP/InP LD in Soldering Process
摘要
介绍影响 InGaAsP/InP 双异质结激光器可靠性的一个主要因素——热阻。通过分析表明
焊料的选择是决定器件实际寿命的关键因素。实验中采用不同的锡(Su)焊料
结果表明
对于高可靠的 InGaAaP/InP 双异质结激光器
金锡焊料(AuSn)是理想的选择。
Abstract
The paper gives an idea that one of the main factors which affects the reliability of the InGaAsP/InP double-heterostructure laser diodes is the thermal resistance.The selection of the chip solder is analyzed to be the key to actual life time of devices.The experimental results show that AuSn alloy is the ideal solder for high reliability laser diodes.