The applications of the pre-bonding PCB technique improves the product consistency in mass production of RF power amplifier modules

but at the same time it brings about new problems in the device grounding

i.e.poor grounding leads to poor performances and instability of the devices.This paper theoretically analyzes the causes for the problems of the new technique on the basis of the comparison between the conventional techniques and the pre-bonding PCB technique and proposes a simple and feasible solution

thus making this technique successfully applied in the production of the above-mentioned modules.