Study on heat dissipation of coaxially packaged LD

Li Weijie1; Wang Guoguo1; Xu Hongchun1; Cao Fang1

doi:10.13756/j.gtxyj.2011.02.004

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Study on heat dissipation of coaxially packaged LD

- Study on heat dissipation of coaxially packaged LD
- Study on Optical communication Issue 2, Pages: 46-49(2011)
- 作者机构：
  
  1. 光纤通信技术和网络国家重点实验室
  2. 武汉电信器件有限公司
- 作者简介：
- 基金信息：
- DOI：10.13756/j.gtxyj.2011.02.004
  CLC： TN248.4
- Published：2011，
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[1]李维杰,王果果,徐红春,曹芳.同轴封装半导体激光器的散热研究[J].光通信研究,2011(02):46-49.

Li Weijie1, Wang Guoguo1, Xu Hongchun1, et al. Study on heat dissipation of coaxially packaged LD. [J]. (2):46-49(2011)
[1]李维杰,王果果,徐红春,曹芳.同轴封装半导体激光器的散热研究[J].光通信研究,2011(02):46-49. DOI： 10.13756/j.gtxyj.2011.02.004.

Li Weijie1, Wang Guoguo1, Xu Hongchun1, et al. Study on heat dissipation of coaxially packaged LD. [J]. (2):46-49(2011) DOI： 10.13756/j.gtxyj.2011.02.004.

摘要

通过对激光器传热过程的理论分析

建立了同轴封装半导体激光器的物理散热模型

利用计算流体力学（CFD）软件对TO56和TO38两种同轴封装的半导体激光器进行了散热模拟分析

并设计了相关的实验（在激光器里面装上热敏电阻）对激光器管芯的温度进行检测

实验结果与仿真结果非常吻合

对激光器组件的设计有一定的指导意义。

Abstract

A physical heat dissipation model of coaxially packaged LD is built on the basis of the theoretical analysis of laser heat transfer process.Heat dissipation simulation analysis is made of two types of such LD

TO56 and TO38

by using the Computational Fluid Dynamics（CFD） software and a relevant experiment

i.e.a thermal resistance is installed in the LD

is designed to test the temperature of the laser-chip on submount.The experimental results are in a good agreement with the simulation

which has a certain guiding significance to the laser subassembly design.

关键词

同轴封装半导体激光器散热计算流体力学

Keywords

coaxial packagingSemiconductor laserheat dissipationCFD

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Related Institution

College of Electrical and Power Engineering, Taiyuan University of Technology

Accelink Technologies Co., Ltd.

College of Electronic and Optical Engineering & College of Microelectronics, Nanjing University of Posts and Telecommunications

School of Optoelectronic Engineering,Nanjing University of Posts and Telecommunications

College of Physics and Electronic Engineering,Yangtze Normal University

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