With the rapid increase of the integration degree and working frequency of electronic devices as well as their wiring density and signal frequency

signal delay and poor electromagnetism compatibility will inevitably occur in copper wire-connected electric interconnections.In order to satisfy the requirement for the processing and transmission of high frequency signals and data and in view of the advantages of high optical transmission frequency and resistance to electromagnetic interference

we conducted researches on the photoelectric substrate layout and fabrication technologies and the optoelectronic signal transmission and detection technology by using the microfiber with the traditional substrate fabrication technology

broke through such key technologies as fiber embedding and photoelectric coupling and finally solved the problem of fiber-embedded photoelectric substrate fabrication.The fiber-embedded optoelectronic interconnection technology can effectively break the bottleneck in the interconnection of high frequency signals in the course of transmission and processing

ensuring the development of new generation informationized equipment.