Research on 100 Gbit/s Hybrid-Integrated EML Transmitter Optical Sub-assembly

Ding Shen; LIU Cheng-gang; SONG Xiao-ping; MEI Xue; XU Hong-chun

doi:10.13756/j.gtxyj.2018.01.010

您当前的位置：

首页 >

文章列表页 >

Research on 100 Gbit/s Hybrid-Integrated EML Transmitter Optical Sub-assembly

- Research on 100 Gbit/s Hybrid-Integrated EML Transmitter Optical Sub-assembly
- Study on Optical communication Issue 1, Pages: 33-37(2018)
- 作者机构：
  
  1. 武汉光迅科技股份有限公司
  2. 武汉邮电科学研究院
- 作者简介：
- 基金信息：
- DOI：10.13756/j.gtxyj.2018.01.010
  CLC： TN929.5
- Published：2018，
扫描看全文
[1]丁深,刘成刚,宋小平,梅雪,徐红春.100 Gbit/s混合集成EML光发射组件的研究[J].光通信研究,2018(01):33-37.

Ding Shen, LIU Cheng-gang, SONG Xiao-ping, et al. Research on 100 Gbit/s Hybrid-Integrated EML Transmitter Optical Sub-assembly. [J]. (1):33-37(2018)
[1]丁深,刘成刚,宋小平,梅雪,徐红春.100 Gbit/s混合集成EML光发射组件的研究[J].光通信研究,2018(01):33-37. DOI： 10.13756/j.gtxyj.2018.01.010.

Ding Shen, LIU Cheng-gang, SONG Xiao-ping, et al. Research on 100 Gbit/s Hybrid-Integrated EML Transmitter Optical Sub-assembly. [J]. (1):33-37(2018) DOI： 10.13756/j.gtxyj.2018.01.010.

摘要

云计算、大数据等互联网应用导致通信流量快速增长

第五代移动通信的到来会进一步加快这一趋势。为了满足大容量、高端口密度、低功耗数据中心互连以及城域网应用的要求

100Gbit/s光模块从外形封装可插拔（CFP）模块演变到CFP2又演变到四通道小型化可插拔（QSFP）模块。光模块尺寸和功耗的降低对光发射组件提出了更高要求。因此采用混合集成封装技术减小光发射组件的尺寸、降低功耗和成本是未来的发展方向。文章介绍了目前研发的QSFP 28封装100Gbit/s混合集成电吸收调制激光器光发射组件所采用的关键技术

给出了符合100GBASE-LR4国际标准的工作眼图

并就未来光发射组件的发展方向做出了展望。

Abstract

Recently

owing to the thriving business of internet applications

such as cloud computing and big data

communication traffic is growing rapidly.The fifth generation mobile communication technology will also further accelerate this trend.In order to satisfy the need of high capacity

high terminal density

lower power dissipation of data center interconnectivity and the need of metropolitan area network application

100 Gbit/s optical module has evolved from Centum Form-factor Pluggable（CFP）to CFP2 and further to Quad Small Form-factor Pluggable（QSFP）.The reduction in size and power dissipation of the optical module is a greater challenge to transmitter optical sub-assembly.Therefore

adopting hybrid-integrated packaging technology is the future direction for Transmitter Optical Sub-Assembly（TOSA）packaging

which can not only reduce the size of TOSA

but its power dissipation and cost as well.In this article

we introduce a QSFP28 100 Gbit/s hybrid-integrated Electroabsorption Modulated Laser（EML）TOSA

including its core technology

and show four eye diagrams that are up to the standard of 100 GBASE-LR4.Finally

a brief prediction of the future development of TOSA is made.

关键词

激光器光学系统容差分析光发射组件电吸收调制激光器

Keywords

lasersoptical system tolerance analysisTOSAEML

references

更多指标>

Views

215

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

MOCVD Growth AlGaInAs/InP Multiple Quantum Well Laser

40 Gbit/s IM/DD-OFDM transmission over 40 km SSMF using 10 Gbit/s-class devices

Related Author

No data

Related Institution

College of Physics and Optoelectronics, Taiyuan University of Technology

College of Information Engineering,Taiyuan University of Technology

Wuhan Telecommunication Devices Co.,Ltd.

State Key Laboratory of Optical Communication Technologies and Networks

Faculty of Information Engineering and Automation,Kunming University of Science and Technology

⁰