NING Jing, SONG Xiao-ping, LIU Cheng-gang, et al. Compensation Design of Interconnection Structure in Optical Module. [J]. Study on Optical Communications (3):48-51(2021)
DOI:
NING Jing, SONG Xiao-ping, LIU Cheng-gang, et al. Compensation Design of Interconnection Structure in Optical Module. [J]. Study on Optical Communications (3):48-51(2021) DOI: 10.13756/j.gtxyj.2021.03.011.
Compensation Design of Interconnection Structure in Optical Module
In order to solve the signal integrity problem caused by gold bonding wire or flexible printed circuit interconnection between components in optical module
the electromagnetic characteristics of gold bonding wire and flexible printed circuit are analyzed by three-dimensional electromagnetic simulation software HFSS
and the corresponding compensation structure is designed. The electromagnetic simulation results show that the return loss (within 0~20 GHz frequency range) of gold bonding wire interconnects with compensation structure is increased by about 18 dB
and the insertion loss is reduced by 0.10~0.25 dB. The return loss (within 0~20 GHz frequency range) of the flexible printed circuit with compensation structure is increased by about 17 dB
and the insertion loss is reduced by 0.10 dB. The test results show that the optical module with compensation structure has good transmission performance
and the compensation structure can be effectively applied to the design of interconnection structure in optical module.
Budka T P. Wide-bandwidth Millimeter-wave Bondwire Interconnects[J]. IEEE Trans. Microw. Theory Tech., 2001, 9(4): 715-718.
Zhang Y P, Li D. Antenna-on Chip and Antenna-inpackage Solutions to Highly Integrated Millimeterwave Devices for Wireless Communications[J]. IEEE Trans. Antenna Propa., 2009, 57(10): 2830-2841.
Zhang Y P, Sun M, Chua K M, et al. Antenna-inpackage Design for Wirebond Interconnection to Highly Integrated 60 GHz Radios[J]. IEEE Trans. Antenna Propa., 2009, 57(10): 2842-2852.