Research on Thermal Design for QSFP-DD Transceiver Module

YE Yu; MA Yan-chao

doi:10.13756/j.gtxyj.2022.04.010

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Research on Thermal Design for QSFP-DD Transceiver Module

更新时间：2022-08-01

- Research on Thermal Design for QSFP-DD Transceiver Module
- Study on Optical Communications Issue 4, Pages: 47-51(2022)
- 作者机构：
  
  1.深圳市恒宝通光电子股份有限公司，广东深圳　518000
  2.深圳恒朴光电科技有限公司，广东深圳　518000
- 作者简介：
- 基金信息：
- DOI：10.13756/j.gtxyj.2022.04.010
  CLC： TN256
- Published：10 August 2022，
  
  Received：28 December 2021，
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YE Yu, MA Yan-chao. Research on Thermal Design for QSFP-DD Transceiver Module. [J]. Study on Optical Communications (4):47-51(2022)
DOI：

YE Yu, MA Yan-chao. Research on Thermal Design for QSFP-DD Transceiver Module. [J]. Study on Optical Communications (4):47-51(2022) DOI： 10.13756/j.gtxyj.2022.04.010.

摘要

近年来，双密度四通道小型可插拔封装（QSFP-DD）形式的200/400 Gbit/s光模块，以其相对低功耗和体积小便于高密度部署的优势得到电信市场和数据中心市场的青睐，但高速率和小体积带来的散热条件恶化问题限制了QSFP-DD光模块的使用环境。文章采用有限元方法对QSFP-DD模块进行热学建模仿真，研究了200 Gbit/s QSFP-DD 4通道长距离（LR4）光模块在高温环境下的内部温度场，验证了导热垫对改善模块内部散热条件的效果，并实测了模块在高温环境下的性能，为QSFP-DD光模块的设计和应用提供了参考。

Abstract

In recent years

200/400 Gbit/s transceiver in the form of Quad Small Form Factor Pluggable-Double Density (QSFP-DD) is favored by the market due to their relatively low power consumption and small size for high-density deployment. However

the deterioration of heat dissipation caused by high speed and small size limits the application of QSFP-DD optical modules. In this paper

the finite element method is used to conduct thermal modeling and simulation of QSFP-DD module

and the internal temperature field of 200 Gbit/s QSFP-DD Long Range 4(LR4) optical module in high temperature environment is studied. The effect of thermal pad on improving the internal heat dissipation of the module is verified. The performance of the module in high temperature environment is measured. It provides a reference for the design and application of QSFP-DD transceiver module.

关键词

双密度四通道小型可插拔封装光模块导热垫热分析

Keywords

QSFP-DD optical modulesthermal padthermal analysis

references

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Zhang D, Zhang B, Xiao X, et al. Consideration of Datacenter Optics for 400 G and Beyond[C]//Asia Communications and Photonics Conference. Chengdu, China: IEEE, 2019: T2D.1.

Ghiasi A. QSFP-DD Hardware Specification for QSFP Double Density 8X Pluggable Transceiver[EB/OL].(2019-03-11)[2022-03-23]. https://www.qsfp-dd.com/specification/https://www.qsfp-dd.com/specification/.

蔡媛媛.高速宽带光模块电磁干扰及热设计研究[D].南京:东南大学, 2016.

杨明冬, 全本庆, 关卫林. QSFP+光收发模块的热设计研究[J]. 电子机械工程, 2017, 33(4):38-41.

马静, 李守智. 基于ANSYS的电力电子热稳态分析的研究[C]//2010年电力与能源工程学术会议. 中国，武汉: PEEC, 2010: 479-483.

答邦宁. 导热衬垫在印制板组件上的应用研究[J]. 电子机械工程, 2013, 29(3):50-52, 64.

ICT杂谈. Samtec:QSFP-DD鼠笼和散热器的热设计[EB/OL]. (2019-10-05)[2021-12-28]. https://zhuanlan.zhihu.com/p/85250640https://zhuanlan.zhihu.com/p/85250640.

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