High Efficiency Video Coding（HEVC） standard puts higher requirements on system bandwidth while improving the coding performance. The traditional electrical interconnection method has the problems of small bandwidth and large delay. Therefore

the high bandwidth and low power consumption of the optical interconnection propose a new solution for on-chip resource data communication. However

due to the limitation of the process level

the integrated optical device cannot be implemented inside the Field Programmable Gate Array（FPGA） chip. Therefore

the off-chip optical device is used to simulate the on-chip optical interconnection system to achieve the purpose of prototype verification. In this paper

based on the BEE4 development platform

the electrical interconnection is used for data communication on a single chip. The optical communication link is built by connecting Quad Small Form-factor Pluggable Plus（QSFP+） optical modules between Xilinx V6 series FPGA chips

and an optical communication network is constructed to realize the prototype of the optical hybrid interconnection network system. Taking the standard test sequence akiyo

q

cif

1

76×144.yuv with resolution of 176×144 as an example

experimental results show that the optical link can replace the inter-chip electrical communication correctly

and the transmission time between boards is only half of electrical interconnection with integrated frequency of 51.327 MHz.