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1.武汉光迅科技股份有限公司,武汉 430205
2.武汉邮电科学研究院,武汉 430074
宁静(1996-),女,河南漯河人。硕士,主要研究方向为光器件与光模块。
宋小平,工程师。E-mail:xiaoping.song@accelink.com
纸质出版日期:2021-06-10,
收稿日期:2020-11-04,
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宁静, 宋小平, 刘成刚, 等. 光模块中互连结构的补偿设计[J]. 光通信研究, 2021,(3):48-51.
NING Jing, SONG Xiao-ping, LIU Cheng-gang, et al. Compensation Design of Interconnection Structure in Optical Module[J]. Study on Optical Communications, 2021,(3):48-51.
宁静, 宋小平, 刘成刚, 等. 光模块中互连结构的补偿设计[J]. 光通信研究, 2021,(3):48-51. DOI: 10.13756/j.gtxyj.2021.03.011.
NING Jing, SONG Xiao-ping, LIU Cheng-gang, et al. Compensation Design of Interconnection Structure in Optical Module[J]. Study on Optical Communications, 2021,(3):48-51. DOI: 10.13756/j.gtxyj.2021.03.011.
为解决光模块中各组件之间使用金丝互连线或柔性电路板互连产生的信号完整性问题,通过三维电磁仿真软件HFSS对金丝互连线和柔性电路板的电磁特性进行分析,并设计了相应的补偿结构。电磁仿真结果表明,具有补偿结构的金丝互连线的回波损耗(在0~20 GHz频率范围内)增加了约18 dB,插入损耗减小了0.10~0.25 dB;具有补偿结构的柔性电路板回波损耗(在0~20 GHz频率范围内)增加了约17 dB,插入损耗减小了0.10 dB。测试结果表明,使用补偿结构的光模块具有良好的传输性能,该补偿结构可以有效地应用于光模块中互连结构的设计。
In order to solve the signal integrity problem caused by gold bonding wire or flexible printed circuit interconnection between components in optical module
the electromagnetic characteristics of gold bonding wire and flexible printed circuit are analyzed by three-dimensional electromagnetic simulation software HFSS
and the corresponding compensation structure is designed. The electromagnetic simulation results show that the return loss (within 0~20 GHz frequency range) of gold bonding wire interconnects with compensation structure is increased by about 18 dB
and the insertion loss is reduced by 0.10~0.25 dB. The return loss (within 0~20 GHz frequency range) of the flexible printed circuit with compensation structure is increased by about 17 dB
and the insertion loss is reduced by 0.10 dB. The test results show that the optical module with compensation structure has good transmission performance
and the compensation structure can be effectively applied to the design of interconnection structure in optical module.
阻抗匹配电容补偿金丝键合柔性电路板
impedance matchingcapacitance compensationwire bondingflexible printed circuit
曾耿华, 唐高弟.微波多芯片组件中键合线的参数提取和优化[J].信息与电子工程, 2007(1): 40-43.
杨玲玲, 孙玲, 孙海燕. IC封装中键合线传输结构的仿真分析[J].电子与封装, 2014, 14(9): 1-4.
严伟, 符鹏, 洪伟. LTCC微波多芯片组件中键合互连的微波特性[J].微波学报, 2003, 19(3): 30-34.
Budka T P. Wide-bandwidth Millimeter-wave Bondwire Interconnects[J]. IEEE Trans. Microw. Theory Tech., 2001, 9(4): 715-718.
Zhang Y P, Li D. Antenna-on Chip and Antenna-inpackage Solutions to Highly Integrated Millimeterwave Devices for Wireless Communications[J]. IEEE Trans. Antenna Propa., 2009, 57(10): 2830-2841.
Zhang Y P, Sun M, Chua K M, et al. Antenna-inpackage Design for Wirebond Interconnection to Highly Integrated 60 GHz Radios[J]. IEEE Trans. Antenna Propa., 2009, 57(10): 2842-2852.
徐兴福, 高宽栋, 任建, 等. HFSS射频仿真设计大全[M].北京: 电子工业出版社, 2015.
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