信息光电子“微电子化”技术进展和发展探讨

张新全; 肖希; 余少华

doi:10.13756/j.gtxyj.2023.06.001

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信息光电子“微电子化”技术进展和发展探讨

特邀 | 更新时间：2023-12-07

- 信息光电子“微电子化”技术进展和发展探讨
- Technological Progress of Information Optoelectronics Microelectronization and Discussion on Its Development
- 光通信研究 2023年第6期页码：1-10
- 作者机构：
  
  1.中国信息通信科技集团有限公司，武汉　430074
  2.光通信技术和网络全国重点实验室，武汉　430074
  3.鹏城实验室，广东　深圳　518000
- 作者简介：
  
  张新全（1974－），男，湖北枝江人。教授级高工，硕士，主要研究方向为光通信和光电子。
  肖希，教授级高工。E-mail：xiaoxi@noeic.com
- 基金信息：
  
  中国工程院战略咨询资助项目(2022-HZ-08)
- DOI：10.13756/j.gtxyj.2023.06.001
  中图分类号： TN201
- 纸质出版日期：2023-12-10，
  
  收稿日期：2022-11-15，
  
  修回日期：2022-12-02，
扫描看全文
张新全，肖希，余少华.信息光电子“微电子化”技术进展和发展探讨[J].光通信研究，2023(6):1-10.

Zhang X Q, Xiao X, Yu S H. Technological Progress of Information Optoelectronics Microelectronization and Discussion on Its Development [J]. Study on Optical Communications, 2023(6):1-10.
张新全，肖希，余少华.信息光电子“微电子化”技术进展和发展探讨[J].光通信研究，2023(6):1-10. DOI： 10.13756/j.gtxyj.2023.06.001.

Zhang X Q, Xiao X, Yu S H. Technological Progress of Information Optoelectronics Microelectronization and Discussion on Its Development [J]. Study on Optical Communications, 2023(6):1-10. DOI： 10.13756/j.gtxyj.2023.06.001.

摘要

微电子技术使电子器件从分立走向集成，带来成本、可靠性、功耗和体积等方面长达几十年的指数级改善，是电子信息技术能够得到广泛应用的关键。当前，电子信息技术正遭遇带宽和能耗等瓶颈制约，摩尔定律步履维艰。光子作为另一种主要的信息载子，具有高带宽、高速率、低功耗和高并行等特性，信息技术的继续进步必须更为倚重光子。但是，光子器件的成本、可靠性和规模生产性等方面严重落后于电子器件。因此，基于电子器件发展的历史经验，我们提出光电子“微电子化”，强调光电子以“集成”为发展轨道，以“光电融合”为发展方向。以集成为发展轨道，是强调光电子需借鉴微电子的经验，以适应现代信息系统对器件的要求。光电子的集成化发展有3个主要特征：一是芯片平台硅基化，二是集成规模稳步提升，三是生产模式向fabless演进。以光电融合为发展方向，是强调光电子需与微电子相互结合，通过两者的器件一体化、功能融合化来共同解决信息技术目前面临的带宽、速率和功耗等挑战，以适应数字孪生和元宇宙等应用的要求。光电融合主要有芯片和系统两个层面，涉及到单片光电集成、光电共封装（CPO）、混合光电集成、设备解汇聚和光电混合计算等。光电子“微电子化”不仅是一种技术发展指引，还将对信息光电子产业形成重要影响。文章从市场、竞争、企业和产品等角度进行了开放式思考，指出其可能引发产业重塑。信息光电子发展的“微电子化”是信息技术继续前进的客观要求。一方面，光子正由传输技术泛化为信息通信技术（ICT）全域的泛在连接技术，宏尺度上从地面进入海洋和太空，微尺度上从架间、板间进入板内、封装内和片内。另一方面，光子将由带宽提供技术泛化为ICT全域的硬件基础技术，从传输和连接进入计算、处理和路由等复杂功能域。光电子的“微电子化”将使光子不仅有潜力而且有能力充分发挥自身优势以支撑信息技术的继续进步。

Abstract

Microelectronics technology has enabled electronic devices from discrete to integrated

bringing exponential improvements in cost

reliability

power consumption

volume and other aspects for decades

which is the key to the wide application of electronic information technology. Currently

electronic information technology is facing bottlenecks such as bandwidth and energy consumption

and Moore’s Law is struggling. As another major carrier of information

photons have characteristics such as high bandwidth

high speed

low power consumption

and high parallelism. The continued progress of information technology must rely more on photons. However

the cost

reliability

and scale productivity of photonic devices lag behind the electronic devices. Therefore

based on the historical experience of the development of electronic devices

we propose the " microelectronization" of optoelectronics

emphasizing that optoelectronics take " integration" as the development track and " photoelectric fusion" as the development direction.Taking integration as the development track is to emphasize that optoelectronics should learn from microelectronics in order to meet the requirements of modern information systems for devices. The integrated development of optoelectronics has three main characteristics: the chip platform basing on silicon; the steady increase in integration scale; and the evolution of production mode towards fabless.Taking photoelectric integration as the development direction

it emphasizes the necessity of the combination of optoelectronics and microelectronics

and jointly solve the challenges of bandwidth

rate

power consumption and other challenges currently faced by information technology through device integration and function integration of the two

so as to meet the requirements of digital twins

metaverse and other applications. Photoelectronic fusion mainly has two levels: chip and system

involving monolithic optoelectronic integration

Co Packaged Optics (CPO)

hybrid optoelectronic integration

device disaggregation

photoelectric hybrid computing

etc.The " microelectronization" of optoelectronics is not only a technological development guide

but also will have a significant impact on the information optoelectronics industry. The article have conducted open-minded thinking from the perspectives of market

competition

enterprises

products

etc.

and pointed out that it may lead to industry reshaping.The " microelectronization" of the development of information optoelectronics is an objective requirement for the continued advancement of information technology. On the one hand

photons are being generalized from transmission technology to ubiquitous connection technology in the entire Information Communications Technology (ICT) domain

from the ground to the ocean and space at the macroscale

and from the shelf and board to the package

and chip at the microscale. On the other hand

photons will be generalized from bandwidth providing technology to a basic hardware technology for the entire ICT domain

from transmission and connection to complex functional domains such as computation

processing

and routing. The " microelectronization" of optoelectronics will enable photons not only have the potential but also the ability to fully utilize their advantages to support the continued progress of the information technology.

关键词

信息光子光电子微电子化硅光子光电融合

Keywords

information photonicsoptoelectronicsmicroelectronizationSiPphotonics-electronics convergence

references

李淳飞. 对微纳光子学发展的一些战略思考[J]. 激光与光电子学进展, 2009, 46(10): 16-22.

Li C F. Strategical Thinking on Development of Micro- and Nano-Photonics[J]. Laser & Optoelectronics Progress, 2009, 46(10):16-22.

余金中. 硅光子学[M]. 北京: 科学出版社, 2011.

Yu J Z. Silicon Photonics[M]. Beijing: Science Press, 2011.

Hennessy J L, Patterson D A. A New Golden Age for Computer Architecture[J]. Communications of the ACM, 2019, 62(2): 48-60.

Theis T N, Wong H S P. The End of Moore’s Law: A New Beginning for Information Technology[J]. Computing in Science & Engineering, 2017, 19(2): 41-50.

张新全. 我国由光通信产业大国发展为光通信产业强国的策略研究[R]. 武汉: 中国信息通信科技集团有限公司, 2017.

Zhang X Q. Study on the Strategy for China to Develop from a Big Nation to a Great Power in Optical Communication Industry[R]. Wuhan: China Information Communication Technologies Group Corporation, 2017.

张新全, 余少华. 光电融合破解带宽、能耗难题[J]. 光通信研究, 2021(5): 1-14.

Zhang X Q, Yu S H. Address the Challenges of Bandwidth and Power Consumption Through Photonics-electronics Convergence[J]. Study on Optical Communications, 2021(5):1-14.

余少华, 张新全. 信息光电子专题[M]. 北京: 科学出版社, 2019.

Yu S H, Zhang X Q. Information Optoelectronics[M]. Beijing: Science Press, 2019.

Feynman R P, Gilbert D. There’s Plenty of Room at the Bottom[J]. Engineering and Science Magazine, 1960, 23: 22-36.

Wetzstein G, Ozcan A, Gigan S, et al. Inference in Artificial Intelligence with Deep Optics and Photonics[J]. Nature, 2020, 588(7836): 39-47.

Ghosh A, Corves B. Scaling Laws: Science of Miniaturization[M]//Introduction to Micromechanisms and Microactuators.New Delhi, India: Springer, 2015: 39-49.

Moore G E. Cramming More Components onto Integrated Circuits, Reprinted from Electronics[J]. IEEE Solid-State Circuits Society Newsletter, 2006, 11(3): 33-35.

黄北举, 张赞, 张赞允, 等. 硅基光电子与微电子单片集成研究进展[J]. 微纳电子与智能制造, 2019(3): 55-67.

Huang B J, Zhang Z, Zhang Z Y, et al.Research Progress on Monolithic Integration of Silicon based Optoelectronics with Microelectronics[J]. Micro/nano Electronics and Intelligent Manufacturing, 2019(3):55-67.

David A B M. Attojoule Optoelectronics for Low-energy Information Processing and Communications[J]. Journal of Lightwave Technology, 2017, 35(3): 346-396.

IEEE. International Roadmap for Devices and SystemsTM [EB/OL]. (2022-01-01)[2022-12-01]. https://irds.ieee.org/https://irds.ieee.org/.

Liu A Y, Bowers J. Photonic Integration with Epitaxial III–V on Silicon[J]. IEEE Journal of Selected Topics in Quantum Electronics, 2018, 24(6): 2854542.

Reed G T, Mashanovich G Z, Gardes F Y, et al. Silicon Optical Modulators[J]. Nature Photonics, 2010, 4(8): 518-526.

Reed G T, Mashanovich G Z, Gardes F Y, et al. Recent Breakthroughs in Carrier Depletion based Silicon Optical Modulators[J]. Nanophotonics, 2014, 3(4-5): 229-245.

Sakib M, Kumar R, Ma C X, et al.A 240 Gb/s PAM4 Siliocon Micro-ring Optical Modulator[C]//Optical Fiber Communication Conference (OFC) 2022. San Diego, CA, US: OFC, 2022: M2D.4.

Wang C, Zhang M, Chen X, et al. Integrated Lithium Niobate Electro-optic Modulators Operating at CMOS-compatible Voltages[J]. Nature, 2018, 562(7725): 101-104.

Xu M Y, Zhu Y T, Pittalà F, et al. Dual-polarization Thin-film Lithium Niobate In-phase Quadrature Modulators for Terabit-per-second Transmission[J]. Optica, 2022, 9(1): 61-62.

Han C H, Jin M, Tao Y S, et al. Ultra-compact Silicon Modulator with 110 GHz Bandwidth[C]//Optical Fiber Communication Conference (OFC) 2022. San Diego, CA, US: OFC, 2022: Th4C.5.

郝然. 对硅基光电子技术发展的思考[J]. 中兴通讯技术, 2017, 23(5): 52-55.

Hao R. Development of the Silicon Photonic Technology[J]. ZTE Technology Journal, 2017, 23(5):52-55.

Johnson J E, Bacher K, Schaevitz R, et al. Performance and Reliability of Advanced CW Lasers for Silicon Photonics Applications [C]//Optical Fiber Communication Conference (OFC) 2022. San Diego, CA, US: OFC, 2022: Tu2D.1

Xiang C, Morton P A, Bowers J E. Ultra-narrow Linewidth Laser based on a Semiconductor Gain Chip and Extended Si3N4 Bragg Grating[J]. Optics Letters, 2019, 44(15): 3825-3828.

Shi W, Tian Y, Gervais A. Scaling Capacity of Fiber-optic Transmission Systems via Silicon Photonics[J]. Nanophotonics, 2020, 9(16): 4629-4663.

讯石光通讯网. Imec完成InP激光器和放大器的硅光子混合集成[DB/OL]. (2021-06-14)[2022-12-01]. http://www.iccsz.com/site/cn/News/2021/06/14/20210614101929406901.htmhttp://www.iccsz.com/site/cn/News/2021/06/14/20210614101929406901.htm.

Xunshi Optical Communication Network. Imec Implements Silicon Photonic Hybrid Integration of InP Lasers and Amplifiers[DB/OL]. (2021-06-14)[2022-12-01]. http://www.iccsz.com/site/cn/News/2021/06/14/20210614101929406901.htmhttp://www.iccsz.com/site/cn/News/2021/06/14/20210614101929406901.htm.

Blum R. Integrated Silicon Photonics for High-volume Data Center Applications[C]//Optical Interconnects XX. San Francisco, CA, US: SPIE, 2020: 2550326.

Jones R, Doussiere P, Driscoll J B, et al. Heterogeneously Integrated InP/Silicon Photonics: Fabricating Fully Functional Transceivers[J]. IEEE Nanotechnology Magazine, 2019, 13(2): 17-26.

Guo X H, He A, Su Y K. Recent Advances of Heterogeneously Integrated III–V Laser on Si[J]. Journal of Semiconductors, 2019, 40(10): 63-73.

Chen S, Selvidge J, Hughes E, et al. A Pathway to Thin GaAs Virtual Substrate on On‐Axis Si (001) with Ultralow Threading Dislocation Density[J]. Physica Status Solidi, A. Applications and Materials Science EPSS, 2021, 218(3): 202000402.

Margalit N, Xiang C, Bowers S M, et al. Perspective on the Future of Silicon Photonics and Electronics[J]. Applied Physics Letters, 2021, 118(22): 220501.

Fathololoumi S, Hui D, Jadhav S, et al. 1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration[J]. Journal of Lightwave Technology, 2021, 39(4): 1155-1161.

讯石光通讯网. 硅光子元件照亮通讯未来[DB/OL]. (2021-11-30)[2022-12-01]. http://www.iccsz.com/site/cn/News/2021/11/30/20211130013410658214.htmhttp://www.iccsz.com/site/cn/News/2021/11/30/20211130013410658214.htm.

Xunshi Optical Communication Network. Silicon Photonic Elements Llluminate the Future of Communication[DB/OL]. (2021-11-30)[2022-12-01]. http://www.iccsz.com/site/cn/News/2021/11/30/20211130013410658214.htmhttp://www.iccsz.com/site/cn/News/2021/11/30/20211130013410658214.htm.

讯石光通讯网. GlobalFoundries宣布推出下一代硅光子解决方案[DB/OL]. (2022-03-09)[2022-12-01]. http://www.iccsz.com/site/cn/News/2022/03/09/20220309132132728609.htmhttp://www.iccsz.com/site/cn/News/2022/03/09/20220309132132728609.htm.

Xunshi Optical Communication Network. GlobalFoundries Announces Next Generation Silicon Photon Solutions[DB/OL]. (2022-03-09)[2022-12-01]. http://www.iccsz.com/site/cn/News/2022/03/09/20220309132132728609.htmhttp://www.iccsz.com/site/cn/News/2022/03/09/20220309132132728609.htm.

Beijing LingYin Information Technology Co., Ltd.Photonic Technology is Ready for the New Bill Gates or Steve Jobs [EB/OL]. (2022-01-01)[2022-12-01]. https://www.linkedin.com/pulse/photonic-technology-ready-new-bill-gates-steve-jobs-martijn-heckhttps://www.linkedin.com/pulse/photonic-technology-ready-new-bill-gates-steve-jobs-martijn-heck.

Orcutt J S, Gill D M, Proesel J, et al. Monolithic Silicon Photonics at 25 Gb/s [C]//Optical Fiber Communications Conference (OFC) 2016. Anaheim, CA, US: OFC, 2016: Th4H.1.

Sally Ward-Foxton. Silicon Photonics Reaches Prime Time [DB/OL]. (2019-04-26)[2022-12-01]. https://www.eetimes.eu/silicon-photonics-reaches-prime-time/https://www.eetimes.eu/silicon-photonics-reaches-prime-time/.

Atabaki A H, Moazeni S, Pavanello F, et al. Integrating Photonics with Silicon Nanoelectronics for the Next Generation of Systems on a Chip[J]. Nature, 2018, 556(7701): 349-354.

Li H, Sakib M N, Huang D, et al. A 106 Gb/s 2.5 Vppd Linear Microring Modulator Driver with Integrated Photocurrent Sensor in 28 nm CMOS[C]//Optical Fiber Communication Conference (OFC) 2022. San Diego, CA, US: OFC, 2022: M2D.1.

Groen E, Boecker C, Hossain M, et al. 6.3 A 10-to-112 Gb/s DSP-DAC-based Transmitter with 1.2 V ppd Output Swing in 7 nm FinFET[C]//2020 International Solid-state Circuits Conference. San Francisco, CA, USA: IEEE, 2020: 9063130.

Wade M, Anderson E, Ardalan S, et al. TeraPHY: A Chiplet Technology for Low-power, High-bandwidth In-package Optical I/O[J]. IEEE Micro, 2020, 40(2): 63-71.

Kaveh H, Edwin K, Sergey Y, et al. 8 Tbps Co-packaged FPGA and Silicon Photonics Optical IO[C]//Optical Fiber Communication Conference (OFC) 2021. Washington, DC, US: OFC, 2021: Th4A.2.

Yole . Silicon Photonics Market and Technology Report 2020[R]. France: Yole, 2020.

Pérez D, Gasulla I, Capmany J. Programmable Multifunctional Integrated Nanophotonics[J]. Nanophotonics, 2018, 7(8): 1351-1371.

Bogaerts W, Pérez D, Capmany J. et al. Programmable Photonic Circuits[J]. Nature, 2020, 586(7828): 207-216.

Sakamoto T, Sato N, Segawa T. Photonics-electronics Convergence Technologies for Disaggregated Computing[J]. NTT Technical Review, 2021, 19(7): 58-64.

Ishizaki T, Yamabe Y. Memory-centric Architecture for Disaggregated Computers[J]. NTT Technical Review, 2021, 19(7): 65-69.

周治平, 许鹏飞, 董晓文. 硅基光电计算[J]. 中国激光, 2020, 47(6): 0600001.

Zhou Z P, Xu P F, Tong X W. Computing on Silicon Photonic Platform[J]. Chinese Lasers, 2020, 47(6):0600001.

张新全, 余少华. 信息化前景和网络演进探讨[J]. 光通信研究, 2021(2): 1-6.

Zhang X Q, Yu S H. Discussion on the Prospect of Informatization and Network Evolution[J]. Study on Optical Communications, 2021(2):1-6.

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