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中国信息通信研究院 技术与标准研究所,北京 100191
刘璐,高级工程师。E-mail:liulu@caict.ac.cn
纸质出版日期:2024-10-10,
收稿日期:2024-02-06,
修回日期:2024-03-12,
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刘璐,吴冰冰. 片间光互连发展态势分析[J]. 光通信研究,2024(5):240029.
Liu L, Wu B B. Analysis of the Development Trend of Inter-Chip Optical Interconnection[J]. Study on Optical Communications, 2024(5):240029.
刘璐,吴冰冰. 片间光互连发展态势分析[J]. 光通信研究,2024(5):240029. DOI: 10.13756/j.gtxyj.2024.240029.
Liu L, Wu B B. Analysis of the Development Trend of Inter-Chip Optical Interconnection[J]. Study on Optical Communications, 2024(5):240029. DOI: 10.13756/j.gtxyj.2024.240029.
随着各行业数字化转型升级进度加快,大数据和云计算等新技术的迅速普及应用,尤其是近两年来,人工智能大模型热潮兴起,带动算力需求快速增长。当前,电子信息技术遭遇带宽和能耗挑战,摩尔定律面临失效危机。相比于电信号,光信号具有传输带宽大、传输损耗小、抗干扰能力强和可并行传输等诸多优势,利用光进行互连成为信息技术发展的重要方向。当前,“光进铜退”趋势持续,光互连的应用场景从机架、板卡进入芯片。在单个芯片封装中集成光子和电子器件,不仅可以提高集成度和端口密度,还可以实现低能耗以及低时延。如何发展片间光互连,成为当前的研究热点之一。文章面向数字时代需求,针对算力基础设施两大典型应用场景——数据中心以及计算中心,梳理了片间光互连的最新技术动态,分析了产业生态与标准化进展,并研判其发展趋势。文章从技术、产业和应用等角度进行了深入探究,明确光互连可以从带宽、能耗和时延等方面有效提升数据中心中交换芯片与外部以及计算中心中计算芯片与外部之间的互连性能。当前片间光互连已取得初步进展,相关技术与标准化研究热度持续上升,产业得到初步落地。相较于数据中心,计算中心片间光互连技术的性能要求更高,产业化标准化进度更为滞后。整体来说,光互连的短距化将使光子进一步发挥自身优势和挖掘应用潜力,支撑信息通信技术的持续进步。
With the acceleration of digital transformation and upgrading across various industries
the rapid popularization and application of new technologies such as big data and cloud computing have driven the exponential growth in demand for computing power
particularly with the emergence of artificial intelligence large models in recent years. Currently
electronic information technology faces challenges related to bandwidth limitations and energy consumption issues
while Moore’s law is confronted with potential failure. In comparison to electrical signals
optical signals offer numerous advantages including larger transmission bandwidth
minimal transmission loss
robust anti-interference capabilities
and parallel transmission. Consequently
optical interconnection has become a crucial direction for information technology development. The ongoing trend of " optical advance and copper retreat" continues as optical interconnection applications transition from racks and boards to chips. Integrating photonic and electronic devices within a single chip package not only enhances integration levels and port density but also achieves lower power consumption rates along with reduced latency periods. Developing inter-chip optical interconnections has emerged as one of the current research topics. The paper analyzes the latest technological trends in optical interconnects between chips
focusing on two key application scenarios of computing infrastructure: data centers and computing centers. It also analyzes the progress of industrial ecology and standardization
while evaluating its development trajectory. This paper conducts a comprehensive study from the perspectives of technology
industry
and application
elucidating that optical interconnection can effectively enhance the interconnection performance between the switching chip and external devices in data centers. It can also improve the performance between the computing chips and external devices in computing centers
with regards to bandwidth
energy consumption
and delay. Currently
there has been initial progress in inter-chip optical interconnection
accompanied by increasing research interest in related technologies and standardization efforts within the industry. However
compared to data centers
inter-chip optical interconnection technology for computing centers has higher performance requirements while lagging behind in industrialization and standardization progress. Overall
short-distance optical interconnections will further leverage their inherent advantages to explore application potential and support continuous advancements in information and communication technology.
数据中心光电合封光输入输出光互连
data centerco-packaged opticsOIOoptical interconnection
张新全, 余少华. 光电融合破解带宽、能耗难题[J]. 光通信研究, 2021(5): 1-14.
Zhang X Q, Yü S H. Address the Challenges of Bandwidth and Power Consumption through Photonics-electronics Convergence[J]. Study on Optical Communications, 2021(5): 1-14.
刘璐, 吴冰冰. 面向下一代数据中心的光电合封技术分析[J]. 通信世界, 2023(10): 45-46.
Liu L, Wu B B. Analysis of Co-packaged Optics Technology for Next Generation Data Center[J]. Communications World, 2023(10): 45-46.
刘璐, 吴冰冰. 片上与片间光互连技术与产业分析[J]. 通信世界, 2023(18): 43-44.
Liu L, Wu B B. On-chip and Inter-chip Optical Interconnection Technology and Industry Analysis[J]. Communications World, 2023(18): 43-44.
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Xuan Z, Balamurugan G, Huang D, et al. A 256 Gbps Heterogeneously Integrated Silicon Photonic Microring-based DWDM Receiver Suitable for In-package Optical I/O[C]//2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits). Kyoto, Japan: IEEE, 2023: 10185280.
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