基于微转印的硅基光子异质集成技术研究进展

李文宇; 吴沂浙; 郑施冠卿; 吴俊衍; 段浩; 宋亦飞; 张宇; 胡虞琳; 徐晨曦; 叶楠; 宋英雄

doi:10.13756/j.gtxyj.2025.250289

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基于微转印的硅基光子异质集成技术研究进展

专题：纪念创刊50周年 | 更新时间：2025-12-25

- 基于微转印的硅基光子异质集成技术研究进展
- Heterogeneous Integrations on the Silicon Photonics Platform by Using the Micro Transfer Printing Method
- 光通信研究 2025年第6期
- 作者机构：
  
  上海大学　通信与信息工程学院　特种光纤与光接入网重点实验室，上海　101400
- 作者简介：
  
  李文宇（1998-），男，吉林扶余人。博士，主要研究方向为异质集成光电芯片。
  叶楠，副教授。E-mail：aslanye@shu.edu.cn
- 基金信息：
  
  科技部重点研发资助项目(2022YFB2804502)
- DOI：10.13756/j.gtxyj.2025.250289
  中图分类号： TN256
- 收稿：2025-09-01，
  
  修回：2025-10-13，
  
  纸质出版：2025-12-10
- 稿件说明：
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李文宇，吴沂浙，郑施冠卿，等. 基于微转印的硅基光子异质集成技术研究进展[J]. 光通信研究，2025(6): 250289.

Li W Y, Wu Y Z, Zheng S G Q, et al. Heterogeneous Integrations on the Silicon Photonics Platform by Using the Micro Transfer Printing Method[J]. Study on Optical Communications, 2025(6): 250289.
李文宇，吴沂浙，郑施冠卿，等. 基于微转印的硅基光子异质集成技术研究进展[J]. 光通信研究，2025(6): 250289. DOI： 10.13756/j.gtxyj.2025.250289.

Li W Y, Wu Y Z, Zheng S G Q, et al. Heterogeneous Integrations on the Silicon Photonics Platform by Using the Micro Transfer Printing Method[J]. Study on Optical Communications, 2025(6): 250289. DOI： 10.13756/j.gtxyj.2025.250289.

摘要

近年来，硅光子异质集成技术不断推进得到迅速发展，为解决硅基材料本身的局限性，微转印技术作为一种新的异质集成方案，在提高产品良率的同时降低了集成成本，其高效率和低损耗等优势逐渐被研究人员重视。文章从转印过程所使用的源材料及预制器件的角度出发，对微转印集成技术应用于硅基光子异质集成领域的研究情况进行了系统性综述。文章还阐明了微转印技术的灵活性与工程适用性，为未来高性能、多功能光子集成器件的开发提供了理论依据与技术参考。

Abstract

In recent years

the technology of silicon photonics heterogeneous integration has been continuously advanced and developed rapidly. To address the limitations inherent in silicon-based materials

micro transfer printing technology

as a novel hetero-integration approach

has received much attentions. This technology not only enhances product yield but also reduces the integration costs

offering advantages such as high efficiency and low loss. This review systematically examines the application of micro transfer printing integration technology on the heterogeneous integrations for the silicon photonics platform focusing on the classification of source material coupon and pre-fabricated devices used in the transfer process. Furthermore

it elucidates the inherent flexibility and engineering applicability of micro transfer printing method

providing both a theoretical support and technical references for the development of advanced and multifunctional photonics integrated devices.

关键词

Keywords

references

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