Thermal Simulation and Experimental Study of QSFP＋ Optical Modules

MAO Jiandong; XIAO Guohua; ZHENG Zijun

doi:10.13756/j.gtxyj.2025.230172

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Thermal Simulation and Experimental Study of QSFP＋ Optical Modules

更新时间：2025-02-17

- Thermal Simulation and Experimental Study of QSFP＋ Optical Modules
- Study on Optical Communications Issue 1, (2025)
- 作者机构：
  
  浙江工商职业技术学院　机电工程学院，浙江　宁波　 315000
- 作者简介：
- 基金信息：
- DOI：10.13756/j.gtxyj.2025.230172
  CLC： TN03;TK121
- Published：10 February 2025，
  
  Received：23 November 2023，
  
  Revised：05 January 2024，
- 稿件说明：
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毛建冬，肖国华，郑子军. QSFP＋光模块热仿真与实验研究[J]. 光通信研究，2025(1): 230172.

Mao J D, Xiao G H, Zheng Z J. Thermal Simulation and Experimental Study of QSFP＋ Optical Modules[J]. Study on Optical Communications, 2025(1): 230172.
毛建冬，肖国华，郑子军. QSFP＋光模块热仿真与实验研究[J]. 光通信研究，2025(1): 230172. DOI： 10.13756/j.gtxyj.2025.230172.

Mao J D, Xiao G H, Zheng Z J. Thermal Simulation and Experimental Study of QSFP＋ Optical Modules[J]. Study on Optical Communications, 2025(1): 230172. DOI： 10.13756/j.gtxyj.2025.230172.

摘要

【目的】

为了研究高速光模块温度分布和风流需求，文章旨在优化散热设计，确保光模块稳定运行。

【方法】

文章采用Flotherm仿真分析建立光模块的数值风洞模型，得到其正常工作时各元器件的温度场分布以及系统稳定时的风扇工作风流量，这些参数符合多源协议（MSA）规范里的散热要求。同时，设计了“L”型风洞治具以方便测试与安装，实验测试了各芯片实际表面温度和风洞的实际工作的风流量，验证了仿真结果的准确性。

【结果】

结果表明，在壳体最高温度为70 ℃时，对于各芯片表面温度，仿真与实测温度差在2 ℃以内，误差在5%以内；对于整个光模块散热所需要的风流量，仿真与实测结果相差0.2立方英尺每分钟（CFM），误差在7%以内。

【结论】

由此证明仿真和实测方法可行，且误差较小，为高速光模块散热设计与测试提供了重要参考依据。

Abstract

【Objective】

In order to study the temperature distribution and airflow requirements of high-speed optical modules

aiming to optimize the heat dissipation design and ensure the stable operation of optical modules.

【Methods】

The article adopts Flotherm simulation analysis to establish the numerical wind tunnel model of the optical module. The temperature distribution of each component during normal operation is obtained. The working air flow of the fan is also obtained when the system is stabilized

which are in line with the heat dissipation requirements in the specification of Multi-Source Agreement (MSA). In order to facilitate the testing and installation

the ”L” type wind tunnel fixture is designed. The actual surface temperature of each chip and the actual working wind flow rate of the wind tunnel are tested experimentally to verify the accuracy of the simulation results.

【Results】

The results show that in the case of the maximum temperature of 70 ℃

for the surface temperature of each chip

the difference between the simulation and the measured temperature is less than 2 ℃

with an error of less than 5%. For the airflow rate required for the heat dissipation of the entire optical module

the difference between the simulation and measured results is 0.2 Cubic Feet per Minute (CFM)

with an error within 7%.

【Conclusion】

It can be shown that the simulation and measurement methods are feasible and the error is small

which provides an important reference value in the design and testing of heat dissipation of high-speed optical modules.

关键词

Keywords

references

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