Photonic Integration and CPO Applications based on TGV Interposer

GE Chang; DU Jiangbing; SHEN Jiaxin; LEI Ting; DU Luping; HE Zuyuan

doi:10.13756/j.gtxyj.2025.250319

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Photonic Integration and CPO Applications based on TGV Interposer

更新时间：2025-12-25

- Photonic Integration and CPO Applications based on TGV Interposer
  增强出版
- Study on Optical Communications Issue 6, (2025)
- 作者机构：
  
  1.上海交通大学光子传输与通信全国重点实验室，上海　200240
  2.深圳大学　a. 微纳光电子学研究院纳米光子学研究中心；b. 射频异质异构集成全国重点实验室，广东　深圳　518060
- 作者简介：
- 基金信息：
- DOI：10.13756/j.gtxyj.2025.250319
  CLC： TN929
- Received：30 September 2025，
  
  Revised：2025-10-24，
  
  Published：10 December 2025
- 稿件说明：
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葛畅，杜江兵，沈嘉欣，等. 玻璃基光电集成封装及CPO应用[J]. 光通信研究，2025(6): 250319.

Ge C, Du J B, Shen J X, et al. Photonic Integration and CPO Applications based on TGV Interposer[J]. Study on Optical Communications, 2025(6): 250319.
葛畅，杜江兵，沈嘉欣，等. 玻璃基光电集成封装及CPO应用[J]. 光通信研究，2025(6): 250319. DOI： 10.13756/j.gtxyj.2025.250319.

Ge C, Du J B, Shen J X, et al. Photonic Integration and CPO Applications based on TGV Interposer[J]. Study on Optical Communications, 2025(6): 250319. DOI： 10.13756/j.gtxyj.2025.250319.

摘要

随着人工智能、第五代移动通信技术（5G）和物联网等信息产业的快速发展以及算力需求的爆发式增长，数据中心和高性能计算对高速、低功耗和高密度互连技术的需求激增，2.5维（2.5D）、三维（3D）等先进光电封装技术受到大量关注并发展成为光电共封装（CPO）技术应用的关键解决方案。相比于传统有机和硅基转接板，玻璃基板凭借其优异的射频性能、面板级低成本制造、高稳定性和可靠性，成为下一代先进光电封装的重要技术路线。文章介绍了玻璃基光电集成封装技术中的关键技术，包括玻璃通孔（TGV）工艺、TGV转接板技术和光波导技术。同时，总结了CPO的应用现状，分析了国内外相关技术路线和进展，包括多种2.5D/3D封装的玻璃基CPO光交换和光引擎。此外，还指出可在玻璃基板上加工玻璃光波导器件，实现耦合、分束和复用等功能，进一步提高玻璃基光电集成的集成度和功能性。因此，玻璃基光电集成封装在CPO场景具有巨大技术优势和应用潜力，未来在光电混合计算和光传感等领域也有巨大的发展空间，是光电先进封装的重要技术路线。

Abstract

With the rapid advancement of information technologies such as artificial intelligence

5th Generation Mobile Communication Technology (5G)

and the Internet of Things

along with the explosive growth in computational demands

data centers and high-performance computing systems are increasingly requiring high-speed

low-power

and high-density interconnection technologies. Advanced photonic packaging technologies such as 2.5 Dimensional (2.5D) and 3 Dimensional (3D) integration have garnered significant attention and evolved into key solutions for Co-Packaged Optics (CPO) applications. Compared to traditional organic and silicon-based interposers

glass interposer has emerged as a critical technological pathway for next-generation advanced photonic packaging

owing to their excellent radio-frequency performance

panel-level low-cost manufacturing

high stability

and reliability. This paper introduces the key technologies in the glass-based photonic integrated packaging technology

including the Through Glass Via (TGV) fabrication

the TGV Interposer technology

and the optical waveguide technology. At the same time

it summarizes the current application status of CPO

analyzes the relevant technical routes and progress both domestically and internationally

including various 2.5D/3D packaged glass-based CPO optical switches and optical engines. Moreover

it points out that glass optical waveguide devices can be processed on the glass substrate to achieve functions such as coupling

splitting

and multiplexing

thereby further improving the integration degree and functionality of glass-based photonic integration. Therefore

glass-based photonic integrated packaging offers significant technical advantages and application potential in CPO scenarios. It also holds substantial promise for future developments in areas such as photonic hybrid computing and optical sensing

establishing itself as a vital technological route in advanced photonic packaging.

关键词

Keywords

references

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