Research on Key Technology and Standardization of 800 Gbit/s and Tbit/s Optical Transceiver Modules

WU Bingbing; LIU Lu; XIE Junjie; LIU Kewei

doi:10.13756/j.gtxyj.2026.250013

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Research on Key Technology and Standardization of 800 Gbit/s and Tbit/s Optical Transceiver Modules

更新时间：2026-03-03

- Research on Key Technology and Standardization of 800 Gbit/s and Tbit/s Optical Transceiver Modules
- Study on Optical Communications Issue 1, (2026)
- 作者机构：
  
  中国信息通信研究院　技术与标准研究院，北京　 100191
- 作者简介：
- 基金信息：
- DOI：10.13756/j.gtxyj.2026.250013
  CLC： TN256
- Received：13 January 2025，
  
  Revised：2025-03-19，
  
  Published：10 February 2026
- 稿件说明：
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吴冰冰，刘璐，谢俊杰，等. 800 Gbit/s及Tbit/s光收发模块关键技术与标准化研究[J]. 光通信研究，2026(1): 250013.

Wu B B, Liu L, Xie J J, et al. Research on Key Technology and Standardization of 800 Gbit/s and Tbit/s Optical Transceiver Modules[J]. Study on Optical Communications, 2026(1): 250013.
吴冰冰，刘璐，谢俊杰，等. 800 Gbit/s及Tbit/s光收发模块关键技术与标准化研究[J]. 光通信研究，2026(1): 250013. DOI： 10.13756/j.gtxyj.2026.250013.

Wu B B, Liu L, Xie J J, et al. Research on Key Technology and Standardization of 800 Gbit/s and Tbit/s Optical Transceiver Modules[J]. Study on Optical Communications, 2026(1): 250013. DOI： 10.13756/j.gtxyj.2026.250013.

摘要

光收发模块是通信网络和数据/智算中心互联的重要基础，随着人工智能的快速发展，高速光收发模块迭代速度明显加快，正逐步向Tbit/s迈进。在梳理光收发模块演进趋势的基础上，文章重点介绍了800 Gbit/s、1.6 Tbit/s和3.2 Tbit/s等速率的直调直检和相干光收发模块技术路线、光电接口与封装形式等国内外标准化进展，芯片器件关键特性，以及线性驱动与光电合封装等新型技术方案，并对未来发展前景进行了展望。

Abstract

The optical transceiver modules are fundamental components of communication networks

data center and intelligent computing center interconnections. With the rapid development of artificial intelligence

the iteration speed of high-speed optical transceiver modules has significantly accelerated

which is gradually moving towards Tbit/s. On the basis of sorting out the evolution trend of optical transceiver modules

this paper focuses on introducing the technical solutions of direct detection and coherent optical transceiver modules with speeds of 800 Gbit/s

1.6 Tbit/s

3.2 Tbit/s

etc. The standardization progress of optoelectronic interfaces and packaging forms

key characteristics of chips and devices

as well as new technological solutions such as linear drive and optoelectronic co-packaging are also illustrated. Finally

the prospects of optical transceiver modules are proposed.

关键词

Keywords

references

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